4 Layer Osp+enig Pcb Base Material: Fr4
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Product Specifications
Hole Size | 0.25 Millimeter (mm) |
Min. Line Spacing | 0.2 Millimeter (mm) |
Flame Resistance Level | 94 V-0 |
Silkscreen | White |
Board Type | Rigid |
Min. Line Width | 0.15 Millimeter (mm) |
Test | E-Test |
Soldermask | Red |
Base Material | FR4 |
Surface Finish | ENIG |
Copper Thickness | 1 OZ Feet (ft) |
Board Thickness | 1.6 Millimeter (mm) |
Color | Red |
Panel Size | 200*250 |
Number Of Layers | 4 Layer |
FOB Port | Yantian |
Payment Terms | Cash on Delivery (COD), Cash Advance (CA), Letter of Credit (L/C), Western Union, Paypal, Cash Against Delivery (CAD), Telegraphic Transfer (T/T), Others, Delivery Point (DP), Days after Acceptance (DA), Cash in Advance (CID), Cheque |
Delivery Time | 5 Days |
Sample Available | Yes |
Sample Policy | Free samples are available |
Main Export Market(s) | Western Europe, Asia, Australia, South America, Eastern Europe, Middle East, Central America, North America, Africa |
Main Domestic Market | All India |
Product Overview
Key Features
Thickness: 1.2+/-0.12 mm
Min Hole Size: 0.3 mm
Width/Space: 0.12mm/0.12 mm
Surface Treatment: ENIG
Craft :
Red Ink
ENIG+OSP
Application :
Consumer Electronics
Company Details
Business Type
Exporter, Manufacturer, Service Provider, Supplier
Employee Count
753
Establishment
2001
Working Days
Monday To Sunday
Payment Mode
Cash on Delivery (COD)
Certification
ISO 9001:2008
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Seller Details
Shenzhen, Guangdong
Address
No 2013, Zhijian Time Square, Henggang Town, Longgang District, Shenzhen, Guangdong, 518126, China
multilayer pcb in Shenzhen
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