
Auto Module Bonding Machine
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Product Overview
Key Features
Auto Module Bonding Machine Range of Application
The machine is for the connecting of copper wire antenna with the module in the production of RFID card.Working principle
X axis take the bonding on direction of left and right moving.Y axis take the bonding on direction of front and back moving.The Cylinder make the sealing head up and down by the CPU control signal.By advanced Ultrasonic technology, make the high electrical current bonding instantly.Auto bonding with the two axis server system and PLC controlling.
Features
When machine running, the system will follow and adjust the ultrasonic parameter automatically.CPU memory data bonding technology, use data freely when operating.Two axis servo system ensures accuracy of welding position.Color display screen with text is used, easy operating.The alarm system will display error message with suggested solutions when machine is stopped.
Tech. Parameters
Out diameter:L1400*W1080mm*H1750mmWeight:about1500KgPower:AC220V 50/60HZCompress air:6Kg/ C㎡Control way: Two axis control+ computerOoerator:1 personWorking speed:1800~2500pcs/hour(related layout).
Company Details
Focusing on a customer-centric approach, EETII GROUP (CHINA) CO., LIMITED has a pan-India presence and caters to a huge consumer base throughout the country. Buy Machineries in bulk from EETII GROUP (CHINA) CO., LIMITED at Trade India quality-assured products.
Business Type
Exporter, Manufacturer, Distributor, Supplier, Trading Company
Establishment
2000
Working Days
Monday To Sunday
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Seller Details
Shenzhen, Guangdong
Director
Mr. Adam Wag
Address
Suit 19B, A Phase, Huamao Xinyun Building, Hongli West Road, Futian Dist., Shenzhen, Guangdong, 518034, China
bonding machine in Shenzhen
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