Bga Soldering Paste Du-430

These BGA Soldering Paste DU-430 is extensive used in SMD reworking procedure such as Cellphone PCB, BGA,PGA,etc. It is used in activator-system of low ionicity,sleek solder fastly, smoking degree lower, the resistance value on SMD surface is very high after residuum solidifies. Therefore, its electrical-property interference to cellphone or other communication products is very small. DU-430 is moderate active-rosin Aid-soldering paste.
It's suitable for south & north bridge graphics card cellphone chip,etc, BGA chip's soldering and rebelling. Also it can be used on detining, the effect is rather ideal.Less residuum, bright welding point, less smog, no irritated smell, stable solder ball, it's absolute & excellent choice of soldering paste.
Friendly reminder:
Notice, soldering paste is chemical product, it easily lose efficacy under high temperature and point-blank sunshine. Please try best to store it in shady and cool place.