Electronic Cooling Design And Thermal Analysis

We are offering Electronic Cooling Design and Thermal Analysis Services to our clients which are situated all round the nation. Our core competencies ensure that our customers can count on highly engineered solutions that refine the capabilities of both passive (advanced cooling methods, liquid cooling/heat pipe/two-phase heat transfer) and active cooling technologies (natural/forced convection air cooling). Using a variety of heat transfer technologies, including advanced cooling methods passive two-phase devices (heat pipes, heat exchangers and more) and single phase devices (liquid cold plates and pumped liquid systems, optimized heat sinks), we apply these technologies to thermal solutions in different industries and horizontal markets.

System level design involves
Selection of fans based on system impedance study
Design of the Heat Sinks or Heat Exchangers for the maximum power
Optimization of the Heat Sink parameters like fins
Analysis of the entire heat transfer phenomenon's in the device
Optimization for min heat generation inside the device
Board level design involves
Design of the circuit that involves placement of components over the board
Design of the solution for cooling the most vulnerable components like placement of heat spreader, design for heat pipe, etc