High Purity 99.99% Electrolytic Copper Cathodes

Material
1)Copper: (C10200,C11000,C10100,C10200,C12000,)C11600,
2)Brass(C21000,C22000,C23000,C24000,C26000,C27000,C27200,C27400,C2800,
C31400,C33000,C35600,C37100,C36000,C35300,C37100,C37700,C37710,C37000,
C68700,C41100,C44300,C46200.C46400,C26130,C65600,)
3)Bronze(C50500,C51100,C52100,C60800,C61000,C61900,C63010,C62300,
C63000,C63280,C63020,C17200,C17000,C17500,C17510,C18200,C18100,C18200,
C16200,C19400,C14500)
4)Cupronickel(C70400,C71000,C71300,C71500,C70400,C70600,C75200,C77000,
C75400,C79000,C79200)
5)T1,T2,T3,TU1,TU0,TU2,TP1,TP2,TAg0.1,H62 /H65 /H68 /H70 /H80 /H90
Surface : Mill,polished,bright,oiled,hair line,brush,mirror,sand blast,or as required

Advantage
Copper is a very ductile and malleable metal. It is high electrical conductivity and high thermal conductivity. Thus, copper parts
have a significant advantage for the production of electronic and electrical components.
Annealing
We possess BA (Bright Annealing; Continuous-Type ), BELL(Bell-Type), and TA (Tension Annealing; Continuous-Type ) furnaces.
Annealing for internal stress removal is also possible as well as soft annealing.
Moreover, according to our accumulated experience and know-how, we can control the size of metallographic structure (carbide grain
size).
Annealing process after plating of JLC (Low cost clad metal) make plating metal and base metal bond strongly by diffusion bonding
structure at the interface between two materials.