Solder And Desolder Station/ Ir Bga Rework Station

These Solder And Desolder Station/ IR BGA Rework Station of GLICHN, 3 zones with Chinese and English touching screen, 3 groups of temperature profiles can be show at the same time, 30 groups of temperature data can be stored. BGA, CSP, LGA (Land Grid Array), Micro SMD, MLF (Micro-Lead Frame), BCC (Bumped Chip Component) and other chips can be deal. it is best equipment for PCB especially large PCB.
Parameters of BGA510C
1 Power consumption: 5000W
2 Top power: 800 W
3 Bottom power: 800 W
4 Bottom infrared preheating: 3000W
5 Power supply: AC220V 50/60HZ or 110V
6 Dimension: i 710mma W680mma H660mm
7 Min PCB: 40mma 40mm
8 Max PCB size: 400A 450mm