Wafer Uv Dicing Tape Film For Semiconductor Cutting

Owing to our rich industrial experience and expertise, we are engaged in exporting and supplying a wide spectrum of Wafer UV Dicing Tape Film For Semiconductor Cutting in Shenzhen, Guangdong, China. UV Dicing Tape an ultra-strong adhesion UV tape, specially designed for deep-cutting process of LED modules, QFN chips, camera modules, etc. It sustains a strong adhesion during dicing and can turn to very low adhesion after UV exposure, then easily peeled off.

Features:
a cThe PO film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not fall off or fly off during grinding and dicing.
a c Not any residue on the surface of wafer or glass which is good for processing.
a c High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily