Zm-r5830 Bga Rework Station For Laptop

We are engaged in offering excellent quality ZM-R5830 BGA Rework Station For Laptop to our valuable clients.
Function is rework BGA Chip of laptop, xbox360 and mobile motherboard, even for lead free BGA Chip.
Feature is touch screen and with 3 heaters, top and bottom hot air heater focus on heating BGA Chip, and 3rd infrared heater is used to prevent deformation.

Technical parameters:
* Total Power : 4500W
* Top heater : 800W
* Bottom heater : 2nd heater 1200W, 3rd IR heater 2400W
* Power supply : AC220VA 10% 50/60Hz
* Dimension : L535*W650*H600mm
* Positioning : V-groove, PCB support can be adjusted in any direction with external universal fixture
* Temperature control : (K Sensor) closed loop, independent heating, precision within 3A .
* PCB size : Max 350*330mm Min 20*20 mm
* Electrical selection : Highly sensitive temperature control module, Touch screen (Taiwan)
* Weight : 34kg
* Package : Wooden Box
* G.W. : 51KG
* Package dimension : L71*W71*H68cm.